1.

Conference Proceedings
Conference Proceedings
1. Vertical Polysilicon Interconnects by Aligned Wafer Bonding
Harendt, C. ; Schuhbauer, A. ; Apel, U. ; Dudek, V. ; Graf, H.-G. ; Hoefflinger, B. ; Penteker, E.
Pub. info.: Proceedings of the Fourth International Symposium on Semiconductor Wafer Bonding : science, technology, and applications.  pp.501-508,  1997.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 97-36
2.

Conference Proceedings
Conference Proceedings
2. Photodiodes in Bonded SOI Films
Harendt, C. ; Beintner, J. ; Schunbauer, A. ; Apel, U. ; Dudek, V. ; Graf, H.-G. ; Hoefflinger, B. ; Seger, U.
Pub. info.: Proceedings of the Fourth International Symposium on Semiconductor Wafer Bonding : science, technology, and applications.  pp.568-575,  1997.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 97-36
3.

Conference Proceedings
Conference Proceedings
3. Novel Device Concept for Voltage-Bias Controlled Color Detection in Amorphous Silicon Sensitized CMOS Cameras
Glockner, J. ; Harendt, C. ; Neidlinger, T. ; Schubert, M. B.
Pub. info.: Flat-panel displays and sensors - principles, materials and processes : symposium held April 4-9, 1999, San Francisco, California, U.S.A..  pp.285-292,  2000.  Pittsburgh, Pa..  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 558