1.

Conference Proceedings
Conference Proceedings
1. The Electrical Integrity of Copper Plated Wafers Using a Novel Plating Bath Chemistry : Feasibility of RTA for Film Stabilization
Simpson, C.R. ; Baker, B.C. ; Herrick, M. ; Basser, P. ; Hamilton, G. ; Weitzman, E. ; Hey, P. ; Subramanyan, S. ; Chen, M. ; Shin, H. Seon ; Dordi, Y. ; Cheung, R. ; Carl, D.
Pub. info.: Interconnect and contact metallization for ULSI : proceedings of the international symposium.  pp.130-138,  1999.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 99-31
2.

Conference Proceedings
Conference Proceedings
2. Delayed Coker Projects - Design Innovation and Project Execution
Louie, W. ; Ogren, D. ; Hamilton, G.
Pub. info.: AIChE ANNUAL MEETING - MARCH 8-12, 1998 - NEW ORLEANS, LA.  1998.  New York.  American Institute of Chemical Engineers
Title of ser.: AIChE meeting [papers]
Ser. no.: 1998
3.

Conference Proceedings
Conference Proceedings
3. The Effective Interfacing of Plastic Molding Machinery and Robotic Equipment
Hamilton, G. ; Gerlitz, F.
Pub. info.: Plastics-pioneering the 21st century : conference proceedings.  pp.319-322,  1987.  Brookfield Center, CT.  Society of Plastics Engineers, Inc. (SPE)
Title of ser.: Annual Technical Conference - ANTEC : Society of Plastics Engineers Annual Technical Papers
Ser. no.: 33
4.

Conference Proceedings
Conference Proceedings
4. Technical approaches for efficient high-precision nucleic acid analysis using DNA microarrays
Pinkel, D. ; Hamilton, G. ; Brown, N. ; Segraves, R. ; Huey, B. ; Snijders, A. ; Blackwood, S. ; Hindle, K. ; Law, S. ; Gray, J. ; Jain, A. ; Hanson, J. ; Nordmeyer, R. ; Albertson, D.
Pub. info.: Biomedical nanotechnology architectures and applications : 20-24 January 2002, San Jose, USA.  pp.82-88,  2002.  Bellingham, Wash..  SPIE-The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 4626
5.

Conference Proceedings
Conference Proceedings
5. CVD Cu Process Development and Integration for Sub-0.18 ｦﾌm Devices
Zhang, J. ; Denning, D. ; Braeckelmann, G. ; Hamilton, G. ; Lee, J. J. ; Venkatraman, R. ; Fiordalice, B. ; Weitzman, E.
Pub. info.: Advanced interconnects and contacts : symposium held April 5-7, 1999, San Francisco, California, U.S.A..  pp.243-,  1999.  Warrendale, Pa..  MRS - Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 564
6.

Conference Proceedings
Conference Proceedings
6. Advanced CVD Barrier Technology for Copper Interconnect
Jain, A. ; Adetutu, O. ; Ekstrom, B. ; Hamilton, G. ; Herrick, M. ; Venkatraman, R. ; Weitzman, E.
Pub. info.: Advanced interconnects and contacts : symposium held April 5-7, 1999, San Francisco, California, U.S.A..  pp.269-,  1999.  Warrendale, Pa..  MRS - Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 564
7.

Conference Proceedings
Conference Proceedings
7. Integration of Multi-Level Copper Metallization into a High-Performance Sub-0.25 ｦﾌm Technology
Venkatraman, R. ; Jain, A. ; Farkas, J. ; Mendonca, J. ; Hamilton, G. ; Capasso, C. ; Denning, D. ; Simpson, C. ; Rogers, B. ; Frisa, L. ; Ong, T. P. ; Herrick, M. ; Kaushik, V. ; Gregory, R. ; Apen, E. ; Angyal, M. ; Filipiak, S. ; Crabtree, P. ; Sparks, T. ; Anderson, S.
Pub. info.: Advanced interconnects and contact materials and processes for future integrated circuits : symposium held April 13-16, 1998, San Francisco, California, U.S.A..  pp.41-,  1998.  Warrendale, Pa..  MRS - Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 514