1.

Conference Proceedings

Conference Proceedings
Wiemer, M. ; Hiller, K. ; Hahn, R. ; Kaufmann, C. ; Gessner, T.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.368-380,  1999.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 99-35
2.

Conference Proceedings

Conference Proceedings
Hanf, M. ; Schaporin, A.V. ; Hahn, R. ; Dotzel, W. ; Gessner, T.
Pub. info.: MEMS/MOEMS Components and Their Applications II.  pp.117-126,  2005.  Bellingham, Wash..  SPIE - The International Society of Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 5717
3.

Conference Proceedings

Conference Proceedings
Hanf, M. ; Kurth, S. ; Billep, D. ; Hahn, R. ; Faust, W. ; Heinz, S. ; Doetzel, W. ; Gessner, T.
Pub. info.: Microwave and Optical Technology 2003.  pp.128-131,  2004.  Bellingham, Wash..  SPIE - The International Society of Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 5445
4.

Conference Proceedings

Conference Proceedings
Kurth, S. ; Kaufmann, C. ; Hahn, R. ; Mehner, J. ; Dotzel, W. ; Gessner, T.
Pub. info.: MOEMS Display and Imaging Systems III.  pp.23-33,  2005.  Bellingham, Wash..  SPIE - The International Society of Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 5721