Mechanisms of Low-Temperature Ti/Si-Based Wafer Bonding

Mechanisms of Low-Temperature Ti/Si-Based Wafer Bonding

Author(s):

Yu, Jian

Publication title:

Materials, technology and reliability of advanced interconnects - 2005 : symposium held March 28-April 1, 2005, San Francisco, California, U.S.A.

Title of ser.:

Materials Research Society symposium proceedings

Ser. no.:

863

Pub. Year:

2005

Page(from):

387

Page(to):

392

Pages:

6

Pub. info.:

Warrendale, Pa.: Materials Research Society

ISSN:

02729172

ISBN:

9781558998162 [1558998160]

Language:

English

Call no.:

M23500/863

Type:

Conference Proceedings

Details

TDL ID:	ZA00014507
Series ID:	PA00000011
Conf. info. (Name):	MRS Spring Meeting
Conf. info. (Number):	2005
Conf. info. (Venue):	San Francisco, California, U.S.A.
Conf. info. (Date):	2005.03.28-2005.04.01

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