1.

Conference Proceedings
Conference Proceedings
1. 1000 V, 30 A SiC Bipolar Junction Transistors and Integrated Darlington Pairs
Krishnaswami, S. ; Agarwal, A. ; Capell, C. ; Richmond, J. ; Ryu, S. H. ; Palmour, J. ; Balachandran, S. ; Chow, T. P. ; Bayne, S. ; Geil, B. ; Jones, K. A. ; Scozzie, C.
Pub. info.: Silicon carbide and related materials 2004 : ECSCRM 2004 : proceedings of the 5th European Conference on Silicon Carbide and Related Materials, August 31 - September 4 2004, Bologna, Italy.  pp.901-904,  2005.  Uetikon-Zuerich.  Trans Tech Publications
Title of ser.: Materials science forum
Ser. no.: 483-485
2.

Conference Proceedings
Conference Proceedings
2. Lateral Epitaxial Overgrowth and Pendeo Epitaxy of 3C-SiC on Si Substrates
Saddow, S. E. ; Carter, G. ; Geil, B. ; Zheleva, T. ; Melnychuck, G. ; Okhuysen, M. E. ; Mazzola, M. S. ; Vispute, R. D. ; Derenge, M. ; Ervin, M. ; Jones, K.
Pub. info.: Silicon carbide and related materials - 1999 : ICSCRM'99, proceedings of the International Conference on Silicon Carbide and Related Materials - 1999, Research Triangle Park, North Carolina, USA, October 10-15, 1999.  pp.245-248,  2000.  Zuerich, Switzerland.  Trans Tech Publications
Title of ser.: Materials science forum
Ser. no.: 338-342(1)
3.

Conference Proceedings
Conference Proceedings
3. Annealing Study of Ga Implanted p-Type 6H-SiC for Ohmic Contact Metallizations
Pernatt, M. ; Ikiadis, A.A. ; Vispute, R.D. ; Wood, M.C. ; Derenge, M. ; Geil, B. ; Jones, K.A.
Pub. info.: Silicon carbide--materials, processing and devices : symposium held November 27-29, 2000, Boston, Massachusetts, U.S.A..  2001.  Warrendale, Pa..  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 640
4.

Technical Paper
Technical Paper
4. On-Demand High Energy Density Materials
Litz, M. ; Blaine, K. ; Geil, B. ; Merkel, G. ; Guardala, N. ; Price, J.
Pub. info.: AIAA meeting papers on disc.  2005.  [Reston, Va.].  American Institute of Aeronautics and Astronautics
Title of ser.: AIAA Paper : International Energy Conversion Engineering Conference and Exhibit (IECEC)
Ser. no.: 3rd