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17 results

Conference Proceedings

1. Electrostatic Bonding for Silicon on Glass Applications

Baine, P.T. ; Quinn, L.J. ; Lee, B. ; Mitchell, S.J.N. ; Gamble, H.S. ; Armstrong, B.M.

Pub. info.:	Proceedings of the Fourth International Symposium on Semiconductor Wafer Bonding : science, technology, and applications. pp.214-221, 1997. Pennington, NJ. Electrochemical Society
Title of ser.:	Electrochemical Society Proceedings Series
Ser. no.:	97-36

Conference Proceedings

2. SOI Production using Polish Stops Formed by Trench before Bond Techniques

Gay, D.L. ; Baine, P.T. ; Armstrong, B.M. ; Gamble, H.S.

Pub. info.:	Proceedings of the Fourth International Symposium on Semiconductor Wafer Bonding : science, technology, and applications. pp.536-543, 1997. Pennington, NJ. Electrochemical Society
Title of ser.:	Electrochemical Society Proceedings Series
Ser. no.:	97-36

Conference Proceedings

3. Encroachment on Silicon Substrate by PECVD Deposited Tungsten at Low Temperatures and the Effect of WF5 on Selectivity

Bain, M.F. ; Armstrong., B.M. ; Gamble, H.S.

Pub. info.:	Plasma processing XIII : proceedings of the international symposium. pp.80-89, 2000. Pennington, N.J.. Electrochemical Society
Title of ser.:	Electrochemical Society Proceedings Series
Ser. no.:	2000-6

Conference Proceedings

4. Fabrication of Sub-micron Active Layer SSOI Substrates using Ion Splitting And Wafer Bonding Technologies

Ruddell, F. ; Bain, M. ; Suder, S. ; Hurley, R.E. ; Armstrong, B.M. ; Fusco, V.F. ; Gamble, H.S.

Pub. info.:	Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia. pp.25-30, 2003. Pennington, NJ. Electrochemical Society
Title of ser.:	Electrochemical Society Proceedings Series
Ser. no.:	2003-19

Conference Proceedings

5. Polish Stop Formation for Sub-Micron SOI

Gay, D.L. ; Tweedie, M. ; Armstrong, B.M. ; Gamble, H.S.

Pub. info.:	Proceedings of the Fourth International Symposium on Semiconductor Wafer Bonding : science, technology, and applications. pp.307-312, 1997. Pennington, NJ. Electrochemical Society
Title of ser.:	Electrochemical Society Proceedings Series
Ser. no.:	97-36

Conference Proceedings

6. Besoi using a Silicon Germanium Etch Stop

Li, X. ; Gay, D.L. ; McNeill, D.W. ; Armstrong, B.M. ; Gamble, H.S.

Pub. info.:	Proceedings of the Fourth International Symposium on Semiconductor Wafer Bonding : science, technology, and applications. pp.313-320, 1997. Pennington, NJ. Electrochemical Society
Title of ser.:	Electrochemical Society Proceedings Series
Ser. no.:	97-36

Conference Proceedings

7. Silicon Wafer Direct Bonding for Smart-Cut SOI with Buried Tungsten Silicide Layer

Suder, S.L. ; Hurley, R. ; Li, F.X. ; Bain, M. ; Baine, P. ; MeNeill, D.W. ; Armstrong, B.M. ; Gamble, H.S.

Pub. info.:	Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia. pp.19-19, 2001. Pennington, NJ. Electrochemical Society
Title of ser.:	Electrochemical Society Proceedings Series
Ser. no.:	2001-27

Conference Proceedings

8. Characteristics and Applications of Silicon Direct Bonded Interfaces

McCann, P. ; Devine, C. ; Ruddell, F. ; Baine, P. ; Gamble, H.S. ; Nevin, W.A.

Pub. info.:	Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia. pp.154-165, 2003. Pennington, NJ. Electrochemical Society
Title of ser.:	Electrochemical Society Proceedings Series
Ser. no.:	2003-19

Conference Proceedings

9. Back-end analysis of SOT substrates incorporating metallic layers using a novel non-destructive picosecond ultrasonic technique

Rain, M.F. ; McCusker, N.D. ; McCann, P. ; Nevin, W.A. ; Gamble, H.S.

Pub. info.:	Silicon-on-insulator technology and devices XI : proceedings of the international symposium. pp.63-68, 2003. Pennington, N.J.. Electrochemical Society
Title of ser.:	Electrochemical Society Proceedings Series
Ser. no.:	2003-5

10.

Conference Proceedings

10. Fabrication of sub-micron active layer SSOI substrates using ion splitting and wafer bonding technologies

Ruddell, F.H. ; Rain, M.F. ; Suder, S. ; Hurley, R.E. ; Armstrong, R.M. ; Fusco, V.F. ; Gamble, H.S.

Pub. info.:	Silicon-on-insulator technology and devices XI : proceedings of the international symposium. pp.57-62, 2003. Pennington, N.J.. Electrochemical Society
Title of ser.:	Electrochemical Society Proceedings Series
Ser. no.:	2003-5

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Author: Gamble, H.S.