1.

Conference Proceedings
Conference Proceedings
1. Development of high-speed 3D inspection system for solder bumps
Nishiyama,Y. ; Tsukahara,H. ; Oshima,Y. ; Takahashi,F. ; Fuse,T. ; Nishino,T.
Pub. info.: Machine vision applications in industrial inspection VI : 27 January 1998, San Jose, California.  pp.60-67,  1998.  Bellingham, Wash., USA.  SPIE-The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 3306
2.

Conference Proceedings
Conference Proceedings
2. Advantages of SOI technology in low-voltage ULSIs (Invited Paper)
Yoshimi,M. ; Kawanaka,S. ; Yamada,T. ; Terauchi,M. ; Shino,T. ; Fuse,T. ; Oowaki,Y. ; Watanabe,S.
Pub. info.: Microelectronic Device Technology : 1-2 October 1997, Austin, Texas.  pp.178-187,  1997.  Bellingham, Wash., USA.  SPIE-The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 3212