1.

Conference Proceedings
Conference Proceedings
1. Strained Silicon on Insulator Wafers Made by the Smart CutTM Technology
Ghyselen, B. ; Bogumilowicz, Y. ; Aulnette, C. ; Abbadie, A. ; Osternaud, B. ; Besson, P. ; Daval, N. ; Andrieu, F. ; Cayrefourq, I. ; Moriceau, H. ; Ernst, T. ; Tiberj, A. ; Rayssac, O. ; Blondeau, B. ; Mazure, C. ; Lagahe-Blanchard, C. ; Pocas, S. ; Cartier, A.-M. ; Hartmann, J.-M. ; Leduc, P. ; Nardo, C.Di ; Lugand, J.-F. ; Fournel, F. ; Semeria, M.-N. ; Kernevez, N. ; Campidelli, Y. ; Kermarrec, O. ; Morand, Y. ; Rivoire, M. ; Bensahel, D. ; Paillard, V. ; Vincent, L. ; Claverie, A. ; Boucaud, P.
Pub. info.: High-mobility group-IV materials and devices : symposium held April 13-15, 2004, San Francisco, California, U.S.A..  pp.83-88,  2004.  Warrendale, Pa..  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 809
2.

Conference Proceedings
Conference Proceedings
2. Ultra High Precision of the Tilt/Twist Misorientation Angles in Silicon/Silicon Direct Wafer Bonding
Fournel, F. ; Monceau, H. ; Leroy, F. ; Eymery, J. ; Gentile, P. ; Rosseau, K. ; Rouviere, J.-L.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.376-385,  2003.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2003-19
3.

Conference Proceedings
Conference Proceedings
3. Transfer of Two-Inch GaN Film by the Smart CutTM Technology
Tauzin, A. ; Akatsu, T. ; Rabarot, M. ; Dechamp, J. ; Zussy, M. ; Moriceau, H. ; Michaud, J.F. ; Charvet, A.M. ; Di Cioccio, L. ; Fournel, F. ; Garrione, J. ; Letertre, F. ; Faure, B. ; Kernevez, N.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.119-127,  2005.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2005-02
4.

Conference Proceedings
Conference Proceedings
4. Overview on Some Recent Advances in Wafer Bonding Technologies
Moriceau, H. ; Fournel, F. ; Rayssac, O. ; Cartier, A.M. ; Morales, C. ; Pocas, S. ; Zussy, M. ; Jalaguier, E. ; Biasse, B. ; Bataillou, B. ; Papon, A.M. ; Lagahe, C. ; Aspar, B. ; Maleville, C. ; Leterte, F. ; Ghyselen, B. ; Barge, T.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.1-16,  2001.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2001-27
5.

Conference Proceedings
Conference Proceedings
5. Smart Cut Technology: the path for advanced SOI substrates
Moriceau, H. ; Lagahe-Blanchard, C. ; Fournel, F. ; Pocas, S. ; Jalaguier, E. ; Perreau, P. ; Deguet, C. ; Ernst, T. ; Beaumont, A. ; Kernevez, N. ; Hartman, J.M. ; Ghyselen, B. ; Aulnette, C. ; Letertre, F. ; Rayssac, O. ; Faure, B. ; Richtarch, C. ; Cayrefourq, I.
Pub. info.: Science and technology of semiconductor-on-insulator structures and devices operating in a harsh environment.  pp.39-52,  2005.  Dordrecht.  Kluwer Academic Publishers
Title of ser.: NATO science series. Series 2, Mathematics, physics and chemistry
Ser. no.: 185
6.

Conference Proceedings
Conference Proceedings
6. Dislocation Networks Strain Fields Induced by Si Wafer Bonding
Eymery, J. ; Fournel, F. ; Rousseau, K. ; Buttard, D. ; Leroy, F. ; Rieutord, F. ; Rouviere, J.L.
Pub. info.: Dislocations and deformation mechanisms in thin films and small structures : symposium held April 17-19, 2001, San Francisco, California, U.S.A..  2001.  Warrendale, PA.  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 673
7.

Conference Proceedings
Conference Proceedings
7. Investigations of Buried Interfaces Using High Energy X-ray Reflectivity
Rieutord, F. ; Eymery, J. ; Plantevin, O. ; Bataillou, B. ; Buttard, D. ; Fournel, F.
Pub. info.: Application of synchrotron radiation techniques to materials science VI : symposium held April 16-20, 2001, San Francisco, California, U.S.A..  2001.  Warrendale, Penn..  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 678