1.

Conference Proceedings
Conference Proceedings
1. Crack Propagation Experiments on Flip-Chip Solder Joints
Wiese, S. ; Feustel, F. ; Rzepka, S. ; Meusel, E.
Pub. info.: Electronic packaging materials science X : symposium held April 14-16, 1998, San Francisco, California, U.S.A..  pp.227-,  1998.  Pittsburgh, Pa..  MRS - Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 515
2.

Conference Proceedings
Conference Proceedings
2. Experimental Characterization of Material Properties of 63Sn37Pb Flip Chip Solder Joints
Wiese, S. ; Feustel, F. ; Rzepka, S. ; Meusel, E.
Pub. info.: Electronic packaging materials science X : symposium held April 14-16, 1998, San Francisco, California, U.S.A..  pp.233-,  1998.  Pittsburgh, Pa..  MRS - Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 515
3.

Conference Proceedings
Conference Proceedings
3. SOI and Low-k in High-Volume Manufacturing
Greenlaw, D. ; Burbach, G. ; Feudel, T. ; Feustel, F. ; Frohberg, K. ; Graetsch, F. ; Grasshoff, G. ; Hartig, C. ; Hempel, K. ; Horstmann, M. ; Huebler, P. ; Kirsch, R. ; Kruegel, S. ; Langer, E. ; Pawlowitsch, A.
Pub. info.: Dielectrics for nanosystems: materials science, processing, reliability, and manufacturing : proceedings of the First international symposium.  pp.42-46,  2004.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2004-04