1.

Conference Proceedings
Conference Proceedings
1. nnovative Substrate Solutions for Wide Band Gap Materials: the Smart CutTM Approach
Letertre, F. ; Daval, N. ; Templier, F. ; DiCioccic, L. ; Richtarch, C. ; Faure, B. ; Cartier, A.M. ; Matko, I.
Pub. info.: State-of-the-art program on compound semiconductors XXXVIII and wide bandgap semiconductors for photonic and electronic devices and sensors III : proceedings of the international symposia.  pp.223-228,  2003.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2003-4
2.

Conference Proceedings
Conference Proceedings
2. Germanium-on-Insulator (GeOI) Structure Realized by the Smart CutTM Technology
Letertre, F. ; Deguet, C. ; Richtarch, C. ; Faure, B. ; Hartmann, J.M. ; Chieu, F. ; Beaumont, A. ; Dechamp, J. ; Morales, C. ; Allibert, F. ; Perreau, P. ; Pocas, S. ; Personnic, S. ; Lagahe-Blanchard, C. ; Ghyselen, B. ; Vaillant, Y.M.Le ; Jalaguier, E. ; Kernevez, N. ; Mazure, C.
Pub. info.: High-mobility group-IV materials and devices : symposium held April 13-15, 2004, San Francisco, California, U.S.A..  pp.153-160,  2004.  Warrendale, Pa..  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 809
3.

Conference Proceedings
Conference Proceedings
3. Recent Progress in Engineered Substrates for GaN Microelectronic Applications
Faure, B. ; Boussagol, A. ; Larheche, H. ; Bressot, S. ; Da Cruz, D. ; Bove, P. ; Letertre, F.(Invited)
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.106-118,  2005.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2005-02
4.

Conference Proceedings
Conference Proceedings
4. Transfer of Two-Inch GaN Film by the Smart CutTM Technology
Tauzin, A. ; Akatsu, T. ; Rabarot, M. ; Dechamp, J. ; Zussy, M. ; Moriceau, H. ; Michaud, J.F. ; Charvet, A.M. ; Di Cioccio, L. ; Fournel, F. ; Garrione, J. ; Letertre, F. ; Faure, B. ; Kernevez, N.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.119-127,  2005.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2005-02
5.

Conference Proceedings
Conference Proceedings
5. Smart Cut Technology: the path for advanced SOI substrates
Moriceau, H. ; Lagahe-Blanchard, C. ; Fournel, F. ; Pocas, S. ; Jalaguier, E. ; Perreau, P. ; Deguet, C. ; Ernst, T. ; Beaumont, A. ; Kernevez, N. ; Hartman, J.M. ; Ghyselen, B. ; Aulnette, C. ; Letertre, F. ; Rayssac, O. ; Faure, B. ; Richtarch, C. ; Cayrefourq, I.
Pub. info.: Science and technology of semiconductor-on-insulator structures and devices operating in a harsh environment.  pp.39-52,  2005.  Dordrecht.  Kluwer Academic Publishers
Title of ser.: NATO science series. Series 2, Mathematics, physics and chemistry
Ser. no.: 185
6.

Conference Proceedings
Conference Proceedings
6. AlGaN / GaN HEMT Structures Grown on SiCOI Wafers Obtained by the Smart CutTM Technology
Larheche, H. ; Faure, B. ; Richtarch, C. ; Letertre, F. ; Langer, R. ; Bove, P.
Pub. info.: Silicon carbide and related materials 2003 : ICSCRM, 2003 : proceedings of the 10th International Conference on Silicon Carbide and Related Materials 2003, Lyon, France, October 5-10, 2003.  pp.1621-1624,  2004.  Uetikon-Zuerich.  Trans Tech Publications
Title of ser.: Materials science forum
Ser. no.: 457-460
7.

Technical Paper
Technical Paper
7. The CHEMCAM Instrument on Mars Science Laboratory (MSL 11): First Laser Induced Breakdown Spectroscopy Instrument in Space!
Saccoccio, M. ; Gaboriaud, A. ; Perez, R. ; Faure, B. ; Gasc, K.
Pub. info.: 39th International Conference on Environmental Systems : SAE technical paper.  2009.  Warrendale, Penn..  Society of Automotive Engineers
Title of ser.: Society of Automotive Engineers technical paper series
Ser. no.: 2009