1.

Conference Proceedings
Conference Proceedings
1. Chemical Free Wafer Bonded of Silicon to Glass and Sapphire
Farrens, S. ; Smith, J.
Pub. info.: Proceedings of the Third International Symposium on Semiconductor Wafer Bonding : physics and applications.  pp.72-77,  1995.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 95-7
2.

Conference Proceedings
Conference Proceedings
2. Low Temperature Wafer Bonding
Farrens, S.
Pub. info.: Proceedings of the Fourth International Symposium on Semiconductor Wafer Bonding : science, technology, and applications.  pp.425-436,  1997.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 97-36
3.

Conference Proceedings
Conference Proceedings
3. Electrical Characterization of Plasma Bonded SOI
Bjeletich, P. ; Farrens, S. ; McLachlan, C.J. ; Leggett, R.W.
Pub. info.: Proceedings of the Fourth International Symposium on Semiconductor Wafer Bonding : science, technology, and applications.  pp.349-357,  1997.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 97-36
4.

Conference Proceedings
Conference Proceedings
4. Plasma activated water bonding for MEMS
Dragoi, V. ; Farrens, S. ; Lindner, P.
Pub. info.: Smart sensors, actuators, and MEMS II : 9-11 May 2005, Seville, Spain.  pp.179-187,  2005.  Bellingham, Wash..  SPIE - The International Society of Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 5836
5.

Conference Proceedings
Conference Proceedings
5. Advanced Anodic Bonding Processes for MEMS Applications
Dragoi, V. ; Lindner, P. ; Glinsner, T. ; Wimplinger, M. ; Farrens, S.
Pub. info.: Micro- and nanosystems : symposium held December 1-3, 2003, Boston, Massachusetts, U.S.A..  pp.337-342,  2004.  Warrendale, Pa..  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 782
6.

Conference Proceedings
Conference Proceedings
6. Plasma Activated Wafer Bonding for Thin Silicon-On-Insulator Substrate Fabrication
Linder, P. ; Farrens, S. ; Dragoi, V.
Pub. info.: Dielectrics for nanosystems: materials science, processing, reliability, and manufacturing : proceedings of the First international symposium.  pp.97-102,  2004.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2004-04
7.

Conference Proceedings
Conference Proceedings
7. Plasma Bonding Replacement Methods for Traditional Bond Technologies
Farrens, S. ; Dragoi, V. ; Pelzer, R. ; Wimplinger, M. ; Lindner, P.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.58-63,  2005.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2005-02
8.

Conference Proceedings
Conference Proceedings
8. A van der Waals Force Model of Bonded Substrates
Farrens, S. ; Dekker, J.
Pub. info.: Proceedings of the Third International Symposium on Semiconductor Wafer Bonding : physics and applications.  pp.184-190,  1995.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 95-7
9.

Conference Proceedings
Conference Proceedings
9. An AFM Study on the Roughness of Silicon Wafers Correlated with Direct Wafer Bonding
Roberds, B. ; Farrens, S.
Pub. info.: Proceedings of the Third International Symposium on Semiconductor Wafer Bonding : physics and applications.  pp.326-341,  1995.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 95-7