1.

Conference Proceedings
Conference Proceedings
1. Rapid Thermal Processing of Wafer Bonded Abrupt Junction Tunnel Diodes
Esser, R.H. ; Hobart, K.D. ; Kub, F.J.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.118-129,  2003.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2003-19
2.

Conference Proceedings
Conference Proceedings
2. A Comparison of Interfacial Fracture Energy of Bonded Wafers Using a Micro- Indentation and Crack Propagation Techniques
Colinge, C.A. ; Shaw, M.C. ; Esser, R.H. ; Hobart, K.D.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.84-91,  2001.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2001-27