1.

Conference Proceedings
Conference Proceedings
1. AFM Studies of Deformation and Interfacial Sliding in Interconnect Structures in Microelectronic Devices
Park, C. ; Dutta, I. ; Peterson, K. A. ; Vella, J.
Pub. info.: Materials, Technology and Reliability for Advanced Interconnects and Low-k Dielectrics-2003 : symposium held April 21-25, 2003, San Francisco, California, U.S.A..  pp.385-390,  2003.  Warrendale, Pa..  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 766
2.

Conference Proceedings
Conference Proceedings
2. Interfacial Sliding In Back-End Interconnect Structures In Microelectronic Devices
Peterson, K.A. ; Park, C. ; Dutta, I.
Pub. info.: Silicon materials - processing characterization and reliability : symposium held April 1-5, 2002, San Francisco, California, U.S.A..  pp.483-488,  2002.  Warrendale.  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 716
3.

Conference Proceedings
Conference Proceedings
3. Determination of the Adhesive Strength of Film-Substrate Interfaces Using the Constant Depth Scratch Test
Dutta, I. ; Campbell, J. C.
Pub. info.: Electronic packaging materials science VIII : symposium held April 17-20, 1995, San Francisco, California, U.S.A..  pp.49-,  1995.  Pittsburgh, Pa..  MRS - Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 390