1.

Conference Proceedings
Conference Proceedings
1. Multifunctional piezoelectric stiffness/energy for monitoring the health of structures
Wakha, K. ; Majed, M.A. ; Dasgupta, A. ; Pines, D.J.
Pub. info.: Smart structures and materials 2003 : Smart structures and integrated systems : 3-6 March 2003, San Diego, California, USA.  pp.60-72,  2003.  Bellingham, Wash., USA.  SPIE-The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 5056
2.

Conference Proceedings
Conference Proceedings
2. Preparation Temperature Effects in Microcrystalline Silicon Thin Film Solar Cells
Vetterl, O. ; Dasgupta, A. ; Lambertz, A. ; Stiebig, H. ; Finger, F. ; Wagner, H.
Pub. info.: Amorphous and heterogeneous silicon-based films - 2001 : symposium held April 16-20, 2001, San Francisco, California, U.S.A..  2001.  Warrendale.  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 664
3.

Conference Proceedings
Conference Proceedings
3. Measurement Of Impurity Profiles In Microcrystalline Silicon Solar Cells By SIMS
Beyer, W. ; Dasgupta, A. ; Finger, F. ; Lambertz, A. ; Ray, S. ; Vetterl, O. ; Zastrow, U.
Pub. info.: Amorphous and heterogeneous silicon thin films - 2000 : symposium held April 24-28, 2000, San Francisco, California, U.S.A..  pp.A13.5-,  2001.  Warrendale.  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 609
4.

Technical Paper
Technical Paper
4. Semi-analytic durability model for surface mount solder joints
Sundararajan, R. ; Neel, J. ; Tiwari, N. ; Dasgupta, A. ; Barker, D.
Pub. info.: A.S.M.E. paper.  1997.  New York.  The American Society of Mechanical Engineers
Title of ser.: ASME Technical Paper : WA/EEP
Ser. no.: 1997
5.

Technical Paper
Technical Paper
5. Stress analysis of surface-mount interconnects due to vibrational loading
Darbha, K. ; Ling, S. ; Upadhyayula, K. ; Dasgupta, A.
Pub. info.: A.S.M.E. paper.  1996.  New York.  The American Society of Mechanical Engineers
Title of ser.: ASME Technical Paper : WA/EEP
Ser. no.: 1996
6.

Technical Paper
Technical Paper
6. Thermomechanical durability analysis of flip chip solder interconnects without underfill
Darbha, K. ; Okura, J.H. ; Dasgupta, A. ; Caers, Jo F. J. M
Pub. info.: A.S.M.E. paper.  1997.  New York.  The American Society of Mechanical Engineers
Title of ser.: ASME Technical Paper : WA/EEP
Ser. no.: 1997
7.

Technical Paper
Technical Paper
7. Solder creep-fatigue analysis by an energy-partitioning approach
Dasgupta, A. ; Oyan, C. ; Barker, D. ; Pecht, M.
Pub. info.: A.S.M.E. paper.  1991.  New York, NY.  The American Society of Mechanical Engineers
Title of ser.: ASME Technical Paper : WA/EEP
Ser. no.: 1991
8.

Technical Paper
Technical Paper
8. Effect of bending on chip scale package interconnects
Shetty, S. ; Lehtinen, V. ; Dasgupta, A. ; Halkola, V. ; Reinikainen, T.
Pub. info.: A.S.M.E. paper.  1999.  New York.  The American Society of Mechanical Engineers
Title of ser.: ASME Technical Paper : IMECE/EEP
Ser. no.: 1999
9.

Technical Paper
Technical Paper
9. A nonlinear multi-domain themomechanical stress analysis method for surface-mount solder joints: Part II: Viscoplastic analysis
Ling, S. ; Dasgupta, A.
Pub. info.: A.S.M.E. paper.  1996.  New York.  The American Society of Mechanical Engineers
Title of ser.: ASME Technical Paper : WA/EEP
Ser. no.: 1996
10.

Technical Paper
Technical Paper
10. A nonlinear multi-domain stress analysis method for surface-mount solder joints
Ling, S. ; Dasgupta, A.
Pub. info.: A.S.M.E. paper.  1995.  New York.  The American Society of Mechanical Engineers
Title of ser.: ASME Technical Paper : WA/EEP
Ser. no.: 1995