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FULL THREE DIMENSIONAL MICROCIRCUIT INTEGRATION TECHNIQUES USING WAFER BONDING

Author(s):
Publication title:
Proceedings of the Second International Symposium on Semiconductor Wafer Bonding--Science, Technology, and Applications
Title of ser.:
Electrochemical Society Proceedings Series
Ser. no.:
1993-29
Pub. Year:
1993
Page(from):
293
Page(to):
302
Pages:
10
Pub. info.:
Pennington, NJ: Electrochemical Society
ISSN:
01616374
ISBN:
9781566770682 [1566770688]
Language:
English
Call no.:
E23400/940556
Type:
Conference Proceedings

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