Extension of high-density interconnect multichip module technology for MEMS packaging

Extension of high-density interconnect multichip module technology for MEMS packaging

Author(s):

Butler,J.T. ( Air Force Institute of Technology )
Bright,V.M. ( Air Force Institute of Technology )
Saia,R.J. ( GE Corporate Research and Development Ctr. )
Comtois,J.H ( Air Force Research Lab. )

Publication title:

Micromachined Devices and Components III

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

3224

Pub. Year:

1997

Page(from):

169

Page(to):

177

Pub. info.:

Bellingham, Wash.: SPIE-The International Society for Optical Engineering

ISSN:

0277786X

ISBN:

9780819426567 [0819426563]

Language:

English

Call no.:

P63600/3224

Type:

Conference Proceedings

Details

TDL ID:	ZA00017397
Series ID:	PA00000029
Conf. info. (Name):	Micromachining and Microfabrication : Micromachined Devices and Components
Conf. info. (Number):	1997 : 3rd
Conf. info. (Venue):	Austin, TX, USA
Conf. info. (Date):	1997.09.29

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