1.

Conference Proceedings
Conference Proceedings
1. Reliability of packaged MEMS in shock environment: crack and striction modeling
Millet, O. ; Collard, D. ; Buchaillot, L.
Pub. info.: Design, test, integration, and packaging of MEMS/MOEMS 2002 : 6-8 May, 2002, Cannes, France.  pp.696-703,  2002.  Bellingham, Wash..  SPIE-The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 4755
2.

Conference Proceedings
Conference Proceedings
2. Study of adhesive forces on a sillicon nanotip by atomic force microscope in contact mode
Agache, V. ; Legrand, B. ; Collard, D. ; Buchaillot, L.
Pub. info.: Design, test, integration, and packaging of MEMS/MOEMS 2002 : 6-8 May, 2002, Cannes, France.  pp.601-612,  2002.  Bellingham, Wash..  SPIE-The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 4755
3.

Conference Proceedings
Conference Proceedings
3. Close infrared thermography using an intensified CCD camera: application in nondestructive high resolution evaluation of electrothermally actuated MEMS [5856-117]
Serio, B. ; Hunsinger, J. J. ; Conseil, F. ; Derderian, P. ; Collard, D. ; Buchaillot, L. ; Ravat, M. F.
Pub. info.: Optical Measurement Systems for Industrial Inspection IV.  pp.819-829,  2005.  Bellingham, Wash..  SPIE - The International Society of Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 5856