1.

Conference Proceedings
Conference Proceedings
1. Influence of He Implantation Conditions on Strain Relaxation and Threading Dislocation Density in Si0.8Ge0-2 Virtual Substrates
Cai, J. ; Mooney, P.M. ; Christiansen, S.H. ; Chen, H. ; Chu, J.O. ; Ott, J.A.
Pub. info.: High-mobility group-IV materials and devices : symposium held April 13-15, 2004, San Francisco, California, U.S.A..  pp.51-56,  2004.  Warrendale, Pa..  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 809
2.

Conference Proceedings
Conference Proceedings
2. Strain Relaxation Mechanisms in He+-Implanted and Annealed Si1-xGex Layers on Si(001) Substrates
Christiansen, S.H. ; Mooney, P.M. ; Chu, J.O. ; Grill, A.
Pub. info.: Materials issues in novel si-based technology : symposium held November 26-28, 2001, Boston, Massachusetts, U.S.A..  pp.27-32,  2002.  Warrendale, Pa..  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 686
3.

Conference Proceedings
Conference Proceedings
3. Wafer Bonding and Layer Transfer Approach for Strained Silicon-on-Insulator(SSOI) Fabrication
Singh, R. ; Radu, I. ; Reiche, M. ; Gosele, U. ; Christiansen, S.H. ; Webb, D.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.89-95,  2005.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2005-02