Low Dielectric Constant Material Deposited by HDPCVD for Barrier and Etch Stop Application in Cu Damascene Structure
- Author(s):
- Cho, S.-M. ( (Applied Materials) )
- Zhang, L. ( (Applied Materials) )
- M'saad, H. ( (Applied Materials) )
- Zhuang, L. ( (Applied Materials) )
- Publication title:
- Low and high dielectric constant materials : materials science, processing, and reliability issues : proceedings of the fifth international symposium
- Title of ser.:
- Electrochemical Society Proceedings Series
- Ser. no.:
- 2000-5
- Pub. Year:
- 2000
- Page(from):
- 48
- Page(to):
- 54
- Pages:
- 7
- Pub. info.:
- Pennington, N.J.: Electrochemical Society
- ISSN:
- 01616374
- ISBN:
- 9781566772709 [1566772702]
- Language:
- English
- Call no.:
- E23400/2000-5
- Type:
- Conference Proceedings
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