1.

Conference Proceedings
Conference Proceedings
1. ALD alumina films as buried dielectric layers for SOI structures
de Beaumont, C. ; Moriceau, H. ; Rayssac, O. ; Bresson, N. ; Cristoloveanu, S. ; Charvet, A.M.
Pub. info.: Silicon-on-insulator technology and devices XII : proceedings of the international symposium.  pp.231-236,  2005.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2005-03
2.

Conference Proceedings
Conference Proceedings
2. Transfer of Two-Inch GaN Film by the Smart CutTM Technology
Tauzin, A. ; Akatsu, T. ; Rabarot, M. ; Dechamp, J. ; Zussy, M. ; Moriceau, H. ; Michaud, J.F. ; Charvet, A.M. ; Di Cioccio, L. ; Fournel, F. ; Garrione, J. ; Letertre, F. ; Faure, B. ; Kernevez, N.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.119-127,  2005.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2005-02
3.

Conference Proceedings
Conference Proceedings
3. 200 mm Germanium-on-Insulator (GeOI) Structures Realized from Epitaxial Wafers using the Smart CutTM Technology
Deguet, C. ; Dechamp, J. ; Morales, C. ; Charvet, A.M. ; Clavelier, L. ; Loup V. ; Hartmann, J.M. ; Kernevez, N. ; Campidelli, Y. ; Allibert, F. ; Richtarche, C. ; Akatsu, T. ; Letertre, F.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.78-88,  2005.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2005-02