1.

Conference Proceedings
Conference Proceedings
1. Electromigration Failure Modes in CU Metallization*
Gall, M. ; Capasso, C. ; Thrasher, S. ; Zhao, L. ; Muiski, P. ; Hernandez, R. ; Herrick, M. ; Angyal, M. ; Boeck, B. ; Kawasaki, H.
Pub. info.: ULSI Process Integration : proceedings of the International Symposium.  pp.410-425,  2001.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2001-2
2.

Conference Proceedings
Conference Proceedings
2. Diffusional Void Growth in Dual-Inlaid Cu Interconnects
Jawarani, D. ; Gall, M. ; Capasso, C. ; Clark, G. ; Hernandez, R. ; Kawasaki, H.
Pub. info.: Interconnect and contact metallization for ULSI : proceedings of the international symposium.  pp.198-205,  1999.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 99-31
3.

Conference Proceedings
Conference Proceedings
3. Statistical Modeling and Experimental Verification of Electromigration Time to Fail Distribution in Metal Interconnects
Capasso, C. ; Gall, M. ; Anderson, S. ; Jawarani, D. ; Hernandez, R. ; Kawasaki, H.
Pub. info.: Proceedings of the Symposium on Interconnect and Contact Metallization.  pp.196-202,  1997.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 97-31
4.

Conference Proceedings
Conference Proceedings
4. HIGH-RESOLUTION CORE LEVEL STUDIES OF INTERDIFFUSION AND REACTION AT METAL-SEMICONDUCTOR INTERFACES
del Giudice, M. ; Joyce, J.J. ; Boscherini, F. ; Capasso, C. ; Weaver, J.H.
Pub. info.: Interfaces, superlattices, and thin films : symposium held December 1-6, 1986, Boston, Massachusetts, U.S.A..  pp.277-282,  1987.  Pittsburgh, Pa..  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 77
5.

Conference Proceedings
Conference Proceedings
5. Experimental Tests on a Lab-Scale Rocket
Russo Sorge, A. ; Carmicino, C. ; Ferrazzano, L. ; Capasso, C.
Pub. info.: Proceedings of the first International Conference on Green Propellants for Space Propulsion, Noordwijk, the Netherlands, 20-22 June 2001.  pp.335-341,  2001.  Noordwijk, The Netherlands.  ESA Publications Division
Title of ser.: ESA SP
Ser. no.: 484
6.

Conference Proceedings
Conference Proceedings
6. METAL/SEMICONDUCTOR INTERFACES WITH NOVEL STRUCTURAL AND ELECTRICAL PROPERTIES: METAL CLUSTER DEPOSITION
Waddili, G. D. ; Vitomirov, I. M. ; Aldao, C. M. ; Anderson, Steven G. ; Capasso, C. ; Weaver, J. H.
Pub. info.: Chemistry and defects in semiconductor heterostructures.  pp.121-124,  1989.  Pittsburgh, Pa..  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 148
7.

Conference Proceedings
Conference Proceedings
7. Critical Length and Resistance Saturation Effects in Al(Cu) Interconnects
Gall,M. ; Muller, J. ; Jawarani, D. ; Capasso, C. ; Hernanndez, R. ; Kawasaki, H.
Pub. info.: Materials reliability in microelectronics VIII : symposium held April 13-16, 1998, San Francisco, California, U.S.A..  pp.231-,  1998.  Pittsburgh, Pa..  MRS - Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 516
8.

Conference Proceedings
Conference Proceedings
8. Statistical Evaluation of Stressmigration Reliability in Al-Cu Interconnects
Jawarani, D. ; Gall, M. ; Capasso, C. ; Muller, J. ; Hernandez, R. ; Kawasaki, H.
Pub. info.: Materials reliability in microelectronics VIII : symposium held April 13-16, 1998, San Francisco, California, U.S.A..  pp.65-,  1998.  Pittsburgh, Pa..  MRS - Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 516
9.

Conference Proceedings
Conference Proceedings
9. Integration of Multi-Level Copper Metallization into a High-Performance Sub-0.25 ｦﾌm Technology
Venkatraman, R. ; Jain, A. ; Farkas, J. ; Mendonca, J. ; Hamilton, G. ; Capasso, C. ; Denning, D. ; Simpson, C. ; Rogers, B. ; Frisa, L. ; Ong, T. P. ; Herrick, M. ; Kaushik, V. ; Gregory, R. ; Apen, E. ; Angyal, M. ; Filipiak, S. ; Crabtree, P. ; Sparks, T. ; Anderson, S.
Pub. info.: Advanced interconnects and contact materials and processes for future integrated circuits : symposium held April 13-16, 1998, San Francisco, California, U.S.A..  pp.41-,  1998.  Warrendale, Pa..  MRS - Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 514