1.

Conference Proceedings
Conference Proceedings
1. Simulations of a Lateral PiN Diode on Si/SiC Substrate for High Temperature Applications
C.W. Chan ; P.M. Gammon ; V.A. Shah ; H. Chen ; M.R. Jennings
Pub. info.: Silicon Carbide and Related Materials 2014 : Selected peer reviewed papers from the European Conference on Silicon Carbide & Related Materials (ECSCRM 2014), September 21-25, 2014, Grenoble, France.  pp.624-627,  2015.  Aedermannsdorf, Switzerland.  Trans Tech Publications
Title of ser.: Materials science forum
Ser. no.: 821-823
2.

Conference Proceedings
Conference Proceedings
2. Si/SiC Substrates for the Implementation of Linear-Doped Power LDMOS Studied with Device Simulation
C.W. Chan ; Y. Bonyadi ; P.A. Mawby ; P.M. Gammon
Pub. info.: Silicon Carbide and Related Materials 2015 : [ICSCRM 2015] : selected, peer reviewed papers from the 16th International Conference on Silicon Carbide and Related Materials, October 4-9, 2015, Giardini Naxos, Italy.  pp.844-847,  2016.  Aedermannsdorf, Switzerland.  Trans Tech Publications
Title of ser.: Materials science forum
Ser. no.: 858
3.

Conference Proceedings
Conference Proceedings
3. The Effect of Interfacial Charge on the Development of Wafer Bonded Silicon-on-Silicon-Carbide Power Devices
P.M. Gammon ; F. Li ; C.W. Chan ; A.M. Sanchez ; S.A. Hindmarsh ; F. Gity ; T. Trajkovic ; V. Kilchytska ; V. Pathirana ; G. Camuso ; K. Ben Ali ; D. Flandre ; P.A. Mawby ; J.W. Gardner
Pub. info.: Silicon Carbide and Related Materials 2016.  pp.747-750,  2017.  Aedermannsdorf, Switzerland.  Trans Tech Publications
Title of ser.: Materials science forum
Ser. no.: 897
4.

Conference Proceedings
Conference Proceedings
4. Numerical Study of Energy Capability of Si/SiC LDMOSFETs
C.W. Chan ; F. Li ; P.A. Mawby ; P.M. Gammon
Pub. info.: Silicon Carbide and Related Materials 2016.  pp.751-754,  2017.  Aedermannsdorf, Switzerland.  Trans Tech Publications
Title of ser.: Materials science forum
Ser. no.: 897