Blank Cover Image

A Study of Interfacial Layer Effect Synthesized by High Energy Ion Cascade on Adhesion Strength Deterioration Between Copper Thin Film and Polyimide Substrates

Author(s):
  • Y.M. Chung ( Center for Advanced Plasma Surface Technology, Sung Kyun Kwan University, Korea )
  • W.S. Jung ( Center for Advanced Plasma Surface Technology, Sung Kyun Kwan University, Korea )
  • C.S. Moon ( Center for Advanced Plasma Surface Technology, Sung Kyun Kwan University, Korea )
  • J.G. Han ( Center for Advanced Plasma Surface Technology, Sung Kyun Kwan University, Korea )
Publication title:
48th annual technical conference proceedings, April 23-28, 2005, Denver, Colorado
Title of ser.:
Annual Technical Conference of Society of Vacuum Coaters
Ser. no.:
48
Pub. Year:
2005
Page(from):
739
Page(to):
744
Pages:
6
Pub. info.:
Albuquerque, NM: Society of Vacuum Coaters
ISSN:
07375921
Language:
English
Call no.:
A63930/48
Type:
Conference Proceedings

Similar Items:

1 Conference Proceedings Enhancement of Adhesion Between Cu Thin Film and Polyimide Modified by Ion Assisted Reaction

Choi, S. C., Kim, K. H., Jung, H-J., Whang, C. N., Koh, S. K.

MRS - Materials Research Society
7 Conference Proceedings SUPPRESSION OF CRYSTAL NUCLEATION IN AMORPHOUS Si THIN FILMS BY HIGH ENERGY ION IRRADIATION AT INTERMEDIATE TEMPERATURES

Im, James S., Shin, Jung H., Atwater, Harry A.

Materials Research Society
2 Conference Proceedings AN ADHESION STYDY OF COPPER AND CHROMIUM FILMS TO POLYIMIDE

Chung, T. G., Yu, Jin, Kim, Y. -H., Ahn, E. C., Park, I. S.

MRS - Materials Research Society
8 Conference Proceedings Adhesion Strength of CuCr Alloy Films to Polyimide

Ahn, E. C., Yu, Jin, Park, I. S.

MRS - Materials Research Society
3 Conference Proceedings Low-k SiBN (Silicon Boron Nitride) Film Synthesized by a Plasma-Assisted Atomic Layer Deposition

S. Yang, J. Kim, J. Noh, H. Kim, S. Lee, J. Ahn, K. Hwang, Y. Shin, U. Chung, J. Moon, D. Lee, I. Yi, R. Jung, S. Kang

Electrochemical Society
9 Conference Proceedings Adhesion Between Polyimide Films and Al2O3 Substrate

Nakamura, Y., Suzuki, Y., Watanabe, Y., Hirayama, S.

MRS - Materials Research Society
4 Conference Proceedings DC and AC Gate-bias Stability of Nanocrystalline Silicon Thin-film Transistors Made on Colorless Polyimide Foil Substrates

I-Chung Chiu, I-Chun Cheng, Jian Z. Chen, Jung-Jie Huang, Yung-Pei Chen

Materials Research Society
10 Conference Proceedings Comparison of Metal-Oxide Nanoparticle Formation in the Cu and Sn Thin Films by the Reaction with Polyimide

Park, H.P., Chung, Y., Yoon, C.S., Jo, S.S., Kim, Y.H.

Trans Tech Publications
5 Conference Proceedings Adhesion of Thin Polymer Films: Effects of Surface and Interfacial Energies and Rheological Properties

Mangipudi S. V., Tirrell M., Pocius V. A.

Society of Plastics Engineers, Inc. (SPE)
11 Conference Proceedings OXYGEN REACTIVE ION BEAM ETCHING ON POLYIMIDE TO ENHANCE COPPER FILM ADHESION

Paik, Kyung W., Ruoff, Arthur L.

Materials Research Society
6 Conference Proceedings SUPPRESSION OF CRYSTAL NUCLEATION IN AMORPHOUS Si THIN FILMS BY HIGH ENERGY ION IRRADIATION AT INTERMEDIATE TEMPERATURES

Im, James S., Shin, Jung H., Atwater, Harry A.

Materials Research Society
12 Conference Proceedings Effect of barrier layer thickness on the performance of thin film transistors on glass substrates

Couillard,J.G., Ast,D.G., Moore,C.B., Fehlner,F.P.

SPIE-The International Society for Optical Engineering
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12