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Conference Proceedings

1. ANALYSIS OF BOND CHARACTERISTICS IN SIDIRECT-BONDED MATERIALS

S.N. Farrens ; B.E. Roberds ; J.K. Smith ; C.B. Hunt

Pub. info.:	Proceedings of the Second International Symposium on Semiconductor Wafer Bonding--Science, Technology, and Applications. pp.81-95, 1993. Pennington, NJ. Electrochemical Society
Title of ser.:	Electrochemical Society Proceedings Series
Ser. no.:	1993-29

Conference Proceedings

2. LOW TEMPERATURE WAFER BONDING OF SURFACES USING A REACTIVE SPUTTERED OXIDE

J.A. Folta ; C.B. Hunt ; S.N. Farrens

Pub. info.:	Proceedings of the Second International Symposium on Semiconductor Wafer Bonding--Science, Technology, and Applications. pp.107-114, 1993. Pennington, NJ. Electrochemical Society
Title of ser.:	Electrochemical Society Proceedings Series
Ser. no.:	1993-29

Conference Proceedings

3. FULL THREE DIMENSIONAL MICROCIRCUIT INTEGRATION TECHNIQUES USING WAFER BONDING

D.B. Booth ; C.B. Hunt ; S. Mani ; S. Glenn

Pub. info.:	Proceedings of the Second International Symposium on Semiconductor Wafer Bonding--Science, Technology, and Applications. pp.293-302, 1993. Pennington, NJ. Electrochemical Society
Title of ser.:	Electrochemical Society Proceedings Series
Ser. no.:	1993-29

Conference Proceedings

4. THE EFFECTS OF PROCESS-INDUCED DEFECTS ON THE CHEMICAL SELECTIVITY OF HIGHLY-DOPED BORON ETCHSTOPS

C.A. Desmond ; C.B. Hunt ; S.N. Farrens

Pub. info.:	Proceedings of the Second International Symposium on Semiconductor Wafer Bonding--Science, Technology, and Applications. pp.423-432, 1993. Pennington, NJ. Electrochemical Society
Title of ser.:	Electrochemical Society Proceedings Series
Ser. no.:	1993-29