1.

Conference Proceedings
Conference Proceedings
1. Layer Transfer of Hydrogen-Implanted Silicon Wafers by Thermal-Microwave Co-Activation
Y. Y. Yang ; C. H. Huang ; Y. -K. Hsu ; S. -J. Jeng ; C. -C. Tai ; S. Lee ; H. -W. Chen ; Q. Gan ; C. -S. Chu ; J. -H. Ting ; C. S. Lai ; T. -H. Lee
Pub. info.: Transistor scaling--methods, materials and modeling : symposium held April 18-19, 2006, San Francisco, California, U.S.A..  pp.111-118,  2006.  Warrendale, Pa..  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 913
2.

Conference Proceedings
Conference Proceedings
2. Effects of the Defects at HfOxNy/Si Interface on Electrical and Reliability Charucteristics of MOS Devices
K. Chang-Liao ; C. L. Cheng ; C. Y. Lu ; C. H. Huang ; S. H. Wang ; T. K. Wang
Pub. info.: Physics and technology of high-k gate dielectrics III.  pp.399-406,  2006.  Pennington, N.J..  Electrochemical Society
Title of ser.: ECS transactions
Ser. no.: 1(5)