Layer Transfer of Hydrogen-Implanted Silicon Wafers by Thermal-Microwave Co-Activation
- Author(s):
Y. Y. Yang C. H. Huang Y. -K. Hsu S. -J. Jeng C. -C. Tai S. Lee H. -W. Chen Q. Gan C. -S. Chu J. -H. Ting C. S. Lai T. -H. Lee - Publication title:
- Transistor scaling--methods, materials and modeling : symposium held April 18-19, 2006, San Francisco, California, U.S.A.
- Title of ser.:
- Materials Research Society symposium proceedings
- Ser. no.:
- 913
- Pub. Year:
- 2006
- Page(from):
- 111
- Page(to):
- 118
- Pages:
- 8
- Pub. info.:
- Warrendale, Pa.: Materials Research Society
- ISSN:
- 02729172
- ISBN:
- 9781558998698 [1558998691]
- Language:
- English
- Call no.:
- M23500/913
- Type:
- Conference Proceedings
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