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Development of a fabrication technology for integrating low cost optical interconnects on a printed circuit board [6126-03]

Author(s):
Van Steenberge, G. ( Ghent Univ. (Belgium) )
Hendrickx, N. ( Ghent Univ. (Belgium) )
Geerinck, P. ( Ghent Univ. (Belgium) )
Bosman, E. ( Ghent Univ. (Belgium) )
Van Put, S. ( Ghent Univ. (Belgium) )
Van Erps, J. ( Vrije Univ. Brussel (Belgium) )
Thienpont, H. ( Vrije Univ. Brussel (Belgium) )
Van Daele, P. ( Ghent Univ.(Beigium) )
3 more
Publication title:
Photonics Packaging and Integration VI
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
6126
Pub. Year:
2006
Page(from):
612603
Pub. info.:
Bellingham, Wash.: SPIE - The International Society of Optical Engineering
ISSN:
0277786X
ISBN:
9780819461681 [0819461687]
Language:
English
Call no.:
P63600/6126
Type:
Conference Proceedings

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