Simulation of the Effect of Dielectric Air Gaps on Interconnect Reliability
- Author(s):
Bassman, L. C. Vinci, R. P. Shieh, B. P. Kim, D-K. McVittie, J. P. Saraswat, K. C. Deal, M. D. - Publication title:
- Materials reliability in microelectronics VII : symposium held April 8-12, 1997, San Francisco, California, U.S.A.
- Title of ser.:
- Materials Research Society symposium proceedings
- Ser. no.:
- 473
- Pub. Year:
- 1997
- Page(from):
- 323
- Pub. info.:
- Pittsburgh, Pa.: MRS - Materials Research Society
- ISSN:
- 02729172
- ISBN:
- 9781558993778 [1558993770]
- Language:
- English
- Call no.:
- M23500/473
- Type:
- Conference Proceedings
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