1.

Conference Proceedings
Conference Proceedings
1. Fabrication of Sub-micron Active Layer SSOI Substrates using Ion Splitting And Wafer Bonding Technologies
Ruddell, F. ; Bain, M. ; Suder, S. ; Hurley, R.E. ; Armstrong, B.M. ; Fusco, V.F. ; Gamble, H.S.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.25-30,  2003.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2003-19
2.

Conference Proceedings
Conference Proceedings
2. Manufacture Processes for WSi2 GPSOI Substrates and Their Influence on Cross-Talk Suppression and Inductance
Baine, P. ; Gamble, H. ; Armstrong, B.M ; Bain, M. ; McNeill, D.W. ; Hamel, J. ; Stefanos, S. ; Kraft, M.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.57-63,  2003.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2003-19
3.

Conference Proceedings
Conference Proceedings
3. Chemical Vapour Deposition of Cobalt for Magnetic Applications
Deo, N. ; Montgomery, J. ; Bain, M. ; Gamble, H.
Pub. info.: Chemical vapor deposition XVI and EUROCVD 14 : proceedings of the international symposium.  pp.1008-1015,  2003.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2003-8
4.

Conference Proceedings
Conference Proceedings
4. Towards a Si/SiGe Quantum Cascade Laser for Terahertz Applications
Paul, D. J. ; Lynch, S. A. ; Townsend, P. ; Ikonic, Z. ; Kelsall, R. W. ; Harrison, P. ; Liew, S. L. ; Norris, D. J. ; Cullis, A. G. ; Zhang, J. ; Bain, M. ; Gamble, H. S. ; Tribe, W. R. ; Arnone, D. D.
Pub. info.: Group-IV semiconductor nanostructures : symposium held November 29-December 2, 2004, Boston, Massachusetts, U.S.A..  pp.59-68,  2005.  Warrendale, Pa..  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 832
5.

Conference Proceedings
Conference Proceedings
5. Silicon Wafer Direct Bonding for Smart-Cut SOI with Buried Tungsten Silicide Layer
Suder, S.L. ; Hurley, R. ; Li, F.X. ; Bain, M. ; Baine, P. ; MeNeill, D.W. ; Armstrong, B.M. ; Gamble, H.S.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.19-19,  2001.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2001-27
6.

Conference Proceedings
Conference Proceedings
6. Silicon-on-Insulator substrates with buried ground planes (GPSOI)
Bain, M. ; Stefanos, S. ; Baine, P. ; Loh, S.H. ; Jin, M. ; Montgomery, J.H. ; Armstrong, B.M. ; Gamble, H.S. ; Hamel, J. ; McNeill, D. W. ; Kraft, M. ; Kemhadjian, H.A.
Pub. info.: Science and technology of semiconductor-on-insulator structures and devices operating in a harsh environment.  pp.273-278,  2005.  Dordrecht.  Kluwer Academic Publishers
Title of ser.: NATO science series. Series 2, Mathematics, physics and chemistry
Ser. no.: 185
7.

Conference Proceedings
Conference Proceedings
7. SiGe heterojunction bipolar transistors on insulating substrates
Hall, S. ; Buiu, O. ; Mitrovic, I.Z. ; Mubarek, H.A. W. El ; Ashburn, P. ; Bain, M. ; Gamble, H.S. ; Wang, Y. ; Hemment, P.L.F. ; Zhang, J.
Pub. info.: Science and technology of semiconductor-on-insulator structures and devices operating in a harsh environment.  pp.261-272,  2005.  Dordrecht.  Kluwer Academic Publishers
Title of ser.: NATO science series. Series 2, Mathematics, physics and chemistry
Ser. no.: 185