1.

Conference Proceedings
Conference Proceedings
1. Electromigration Failure Modes in CU Metallization*
Gall, M. ; Capasso, C. ; Thrasher, S. ; Zhao, L. ; Muiski, P. ; Hernandez, R. ; Herrick, M. ; Angyal, M. ; Boeck, B. ; Kawasaki, H.
Pub. info.: ULSI Process Integration : proceedings of the International Symposium.  pp.410-425,  2001.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2001-2
2.

Conference Proceedings
Conference Proceedings
2. Electroless copper deposition on tungsten for silicon integrated circuits
Mak, C.Y. ; Feldman, L.C. ; Wong, Y-H. ; Weir, B.E. ; Blanco, J. ; Angyal, M. ; Scacham-Diamond, Y.
Pub. info.: Proceedings of the Second International Symposium on Electrochemical Technology Applications in Electronics.  pp.233-256,  1993.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 1993-20
3.

Conference Proceedings
Conference Proceedings
3. Process Control Challenges and Solutions: TEOS, W, and Cu CMP
Angyal, M. ; Boeck, B. ; Cope, J. ; Dang, C. ; Grudowski, P. ; Islam, R. ; Kolagunta, V. ; Mendonca, J. ; Pettinato, C. ; Selinidis, S. ; Smith, B.
Pub. info.: Chemical mechanical polishing -- fundamentals and challenges : symposium held April 5-7, 1999, San Francisco, California, U.S.A..  pp.167-172,  2000.  Warrendale, PA.  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 566
4.

Conference Proceedings
Conference Proceedings
4. Integration of Multi-Level Copper Metallization into a High-Performance Sub-0.25 ｦﾌm Technology
Venkatraman, R. ; Jain, A. ; Farkas, J. ; Mendonca, J. ; Hamilton, G. ; Capasso, C. ; Denning, D. ; Simpson, C. ; Rogers, B. ; Frisa, L. ; Ong, T. P. ; Herrick, M. ; Kaushik, V. ; Gregory, R. ; Apen, E. ; Angyal, M. ; Filipiak, S. ; Crabtree, P. ; Sparks, T. ; Anderson, S.
Pub. info.: Advanced interconnects and contact materials and processes for future integrated circuits : symposium held April 13-16, 1998, San Francisco, California, U.S.A..  pp.41-,  1998.  Warrendale, Pa..  MRS - Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 514
5.

Conference Proceedings
Conference Proceedings
5. Theoretical and Experimental Analysis of the Low Dielectric Constant of Fluorinated Silica
Angyal, M. ; baugh, Ash. ; D, M. ; Demkov, A. ; Filipiak, S. ; Gregory, R. B. ; Kottke, M. ; Liu, R. ; Mclntyre, L. C. ; Werho, D. ; Zollner, S.
Pub. info.: The optical properties of materials : symposium held November 30-December 2, 1999, Boston, Massachusetts, U.S.A..  pp.255-260,  2000.  Warrendale, Pa..  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 579
6.

Conference Proceedings
Conference Proceedings
6. Theoretical And Experimental Analysis Of The Low Dielectric Constant Of Fluorinated Silica
Demkov, A.A. ; Zollner, S. ; Liu, R. ; Werho, D. ; Kottke, M. ; Gregory, R.B. ; Angyal, M. ; Filipiak, S. ; Adams, G.B.
Pub. info.: Materials, technology and reliability for advanced interconnects and low-k dielectrics : symposium held April 23-27, 2000, San Francisco, California, U.S.A..  pp.D3.8-,  2001.  Warrendale, PA.  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 612
7.

Conference Proceedings
Conference Proceedings
7. BEOL lithography for early development at the 65-nm node
DellaGuardia, R. ; Kwong, R.W. ; Li, W. ; Lawson, P. ; Burkhardt, M. ; Grauer, I.C. ; Wu, Q. ; Angyal, M. ; Hichri, H. ; Melville, I. ; Kumar, K. ; Lin, Y. ; Holmes, S.J. ; Varanasi, R. ; Spooner, T. ; McHerron, D.
Pub. info.: Optical Microlithography XVII.  pp.980-987,  2004.  Bellingham, Wash..  SPIE - The International Society of Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 5377