1.

Conference Proceedings
Conference Proceedings
1. Multilayer Au-Si Eutectic Wafer Bonding with Microstructured Sealing Rings
S. Lani ; A. Bosseboeuf ; O. Garel ; F. Parrain ; N. Isac
Pub. info.: Semiconductor Wafer Bonding 10: Science, Technology, and Applications.  pp.147-154,  2008.  Pennington, NJ.  Electrochemical Society
Title of ser.: ECS transactions
Ser. no.: 16(8)
2.

Conference Proceedings
Conference Proceedings
2. Image blur analysis for the subpixel-level measurement of in-plane vibration parameters of MEMS resonators
H. V. Le ; M. Gouiffes ; F. Parrain ; A. Bosseboeuf ; B. Zavidovique
Pub. info.: Applications of digital image processing XXX.  2  pp.66962D-1-66962D-12,  2007.  Bellingham, Wash..  Society of Photo-optical Instrumentation Engineers
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 6696