CMP Technology for the 32-45 nm Node Cu/Low-k Integration (Invited paper)
- Author(s):
Kondo, S. Yoon, B.U. Tokitoh, S. Namiki, A. Misawa, K. Inukai, K. Sone, S. Shin, H.J. Matsubara, Y. Ohashi, N. Kobayashi, N. - Publication title:
- ULSI Process Integration : proceedings of the International Symposium
- Title of ser.:
- Electrochemical Society Proceedings Series
- Ser. no.:
- 2005-06
- Pub. Year:
- 2005
- Page(from):
- 385
- Page(to):
- 394
- Pages:
- 10
- Pub. info.:
- Pennington, N.J.: Electrochemical Society
- ISSN:
- 01616374
- ISBN:
- 9781566774642 [1566774640]
- Language:
- English
- Call no.:
- E23400/200506
- Type:
- Conference Proceedings
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