1.

Conference Proceedings
Conference Proceedings
1. Strength and long-term reliability testing of wafer-bonded MEMS
Petzold, M. ; Katzer, D. ; Wiemer, M. ; Bagdahn, J.
Pub. info.: Design, test, integration, and packaging of MEMS/MOEMS 2002 : 6-8 May, 2002, Cannes, France.  pp.613-623,  2002.  Bellingham, Wash..  SPIE-The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 4755
2.

Conference Proceedings
Conference Proceedings
2. Fabrication of SOI Substrates with Buried Silicide Layers for BiCMOS Applications
Wiemer, M. ; Zimmermann, S. ; Zhao, Q.T. ; Trui, B. ; Kaufmann, C. ; Mantl, S. ; Dudek, V. ; Gessner, T.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.303-310,  2005.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2005-02
3.

Conference Proceedings
Conference Proceedings
3. Mechanical Reliability of Directly Bonded Silicon MEMS Components
Bagdahn, J. ; Wiemer, M. ; Petzold, M.(Invited)
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.253-263,  2005.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2005-02
4.

Conference Proceedings
Conference Proceedings
4. Bonding and Contacting of MEMS-Structures on Wafer Level
Wiemer, M. ; Fromel, J. ; Jia, C. ; Gessner, T.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.301-308,  2003.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2003-19
5.

Conference Proceedings
Conference Proceedings
5. Silicon Wafer Bonding for Encapsulating Surface-Micromechanical-Systems using Intermediate Glass Layers
Knechtel, R. ; Heller, J. ; Wiemer, M. ; Fromel, J.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.321-328,  2003.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2003-19
6.

Conference Proceedings
Conference Proceedings
6. Packaging for MEMS devices: stumbling block or enabling solution?
Jung, E. ; Wiemer, M. ; Grosser, V. ; Bock, K. ; Wolf, J.
Pub. info.: Design, test, integration, and packaging of MEMS/MOEMS 2002 : 6-8 May, 2002, Cannes, France.  pp.508-514,  2002.  Bellingham, Wash..  SPIE-The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 4755
7.

Conference Proceedings
Conference Proceedings
7. Coherent acoustic phonons in nanostructures investigated by asynchronous optical sampling (Invited Paper) [6393-17]
Dekorsy, T. ; Hudert, F. ; Cerna, R. ; Schafer, H. ; Janke, C. ; Bartels, A. ; Kohler, K. ; Braun, S. ; Wiemer, M. ; Mantl, S.
Pub. info.: Nanophotonics for Communication: Materials, Devices, and Systems III.  pp.63930H-,  2006.  Bellingham, Wash..  SPIE - The International Society of Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 6393