1.

Conference Proceedings
Conference Proceedings
1. The Influence of Sharp Notches on the Strength of Directly Bonded Components
Bagdahn, J. ; Katzer, D. ; Petzold, M. ; Wiemer, M.
Pub. info.: Proceedings of the Fourth International Symposium on Semiconductor Wafer Bonding : science, technology, and applications.  pp.285-290,  1997.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 97-36
2.

Conference Proceedings
Conference Proceedings
2. Application of High and Low Wafer Bonding Processes for Bulk Micromachined Components
Wiemer, M. ; Hiller, K. ; Hahn, R. ; Kaufmann, C. ; Gessner, T.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.368-380,  1999.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 99-35
3.

Conference Proceedings
Conference Proceedings
3. Measurement of the Local Strength Distribution of Directly Bonded Silicon Wafers using the Micro-Chevron Test
Bagdahn, J. ; Ploessl, A. ; Wiemer, M. ; Petzold, M.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.218-223,  1999.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 99-35
4.

Conference Proceedings
Conference Proceedings
4. Bonding and Metallization for a High Precision Acceleration Sensor
Gessner, T. ; Wiemer, M. ; Hiller, K. ; Hafen, M.
Pub. info.: Proceedings of the Second International Symposium on Microstructures and Microfabricated Systems.  pp.297-308,  1995.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 95-27