1.
Technical Paper |
Wang, Y. ; Reh, L. ; Pennell, D. ; Winkler, D. ; Dobbeling, K.
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2.
Technical Paper |
Wang, Y. ; Pan, J.
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3.
Technical Paper |
Realff, M.L. ; Braga, R. ; Lipkin, H. ; Wang, Y. ; Holcombe, W. ; McMurry, G.
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