Von Mises Stress in CMP Processes

Von Mises Stress in CMP Processes

Author(s):

Wang, D.

Publication title:

Proceedings of the First International Symposium on Chemical Mechanical Planarization

Title of ser.:

Electrochemical Society Proceedings Series

Ser. no.:

96-22

Pub. Year:

1996

Page(from):

97

Page(to):

109

Pages:

13

Pub. info.:

Pennington, NJ: Electrochemical Society

ISSN:

01616374

ISBN:

9781566771726 [1566771722]

Language:

English

Call no.:

E23400/970318

Type:

Conference Proceedings

Details

TDL ID:	ZA00013855
Series ID:	PA00000028
Conf. info. (Name):	International Symposium on Chemical Mechanical Planarization ; Meeting of the Electrochemical Society
Conf. info. (Number):	1st ; 190th
Conf. info. (Venue):	San Antonio, Texas, USA
Conf. info. (Date):	1996.10.06-1996.10.11

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