1.

Conference Proceedings
Conference Proceedings
1. Mechanical Delamination for the Materials Integration
Henttinen, K. ; Suni, T. ; Nurmela, A. ; Kulawski, M. ; Suni, I.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.359-367,  2003.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2003-19
2.

Conference Proceedings
Conference Proceedings
2. Effects of Plasma Activation on Hydrophilic Bonding of Si and SiO2
Suni, T. ; Henttinen, K. ; Suni, I. ; Maekinen, J.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.22-30,  2001.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2001-27
3.

Conference Proceedings
Conference Proceedings
3. Reliability Of Tantalum Based Diffusion Barriers Between Cu And Si
Laurila, T. ; Zeng, K. ; Seppala, A. ; Molarius, J. ; Suni, I. ; Kivilahti, J.K.
Pub. info.: Materials, technology and reliability for advanced interconnects and low-k dielectrics : symposium held April 23-27, 2000, San Francisco, California, U.S.A..  pp.D7.4-,  2001.  Warrendale, PA.  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 612