Effect of bending on chip scale package interconnects
- Author(s):
- Shetty, S. ( University of Maryland )
- Lehtinen, V.
- Dasgupta, A.
- Halkola, V.
- Reinikainen, T.
- Publication title:
- A.S.M.E. paper
- Title of ser.:
- ASME Technical Paper : IMECE/EEP
- Ser. no.:
- 1999
- Pub. Year:
- 1999
- No.:
- 99-IMECE/EEP-7
- Paper no.:
- 99-IMECE/EEP-7
- Pub. info.:
- New York: The American Society of Mechanical Engineers
- Language:
- English
- Call no.:
- A11800
- Type:
- Technical Paper
Similar Items:
American Society of Mechanical Engineers |
American Society of Mechanical Engineers |
The American Society of Mechanical Engineers |
Society of Manufacturing Engineers |
3
Technical Paper
Solder joint reliability of wafer level chip scale packages (WLCSP): A time-temperature-dependent creep analysis
The American Society of Mechanical Engineers |
9
Technical Paper
Effect of underfill on deformations of surface laminar circuit in flip chip package
The American Society of Mechanical Engineers |
4
Technical Paper
Thermomechanical durability analysis of flip chip solder interconnects without underfill
The American Society of Mechanical Engineers |
10
Technical Paper
Contact Reliability of Innovative Compliant Interconnects for Next Generation Electronic Packaging.
American Society of Mechanical Engineers |
The American Society of Mechanical Engineers |
11
Technical Paper
DESIGN AND FABRICATION OF MONOLITHICALLY INTEGRATED PRESSURE AND TEMPERATURE SENSOR USING MEMS PROCESSES FOR WIDE BAND GAP MATERIALS
American Institute of Aeronautics and Astronautics |
6
Technical Paper
Effect of Seat Belts Equipped with Pretensioners on Rear Seat Adult Occupants in High-Severity Rear Impact.
Society of Automotive Engineers |
The American Society of Mechanical Engineers |