1.

Conference Proceedings
Conference Proceedings
1. The Smart-Cut Process: Status and Developments
Aspar, B. ; Lagahe, C. ; Moriceau, H. ; Jalaguier, E. ; Mas, A. ; Rayssac, O. ; Biasse, Soubie; B. ; Bruel, M. ; Auberton-Hevre, A.J. ; Barge, T. ; Letertre, F. ; Maleville, C.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.48-59,  1999.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 99-35
2.

Conference Proceedings
Conference Proceedings
2. Detailed Characterization of Wafer Bonding Mechanisms
Maleville, C. ; Rayssac, O. ; Moriceau, H. ; Blasse, B. ; Baroux, L. ; Aspar, B. ; Bruel, M.
Pub. info.: Proceedings of the Fourth International Symposium on Semiconductor Wafer Bonding : science, technology, and applications.  pp.46-55,  1997.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 97-36