1.

Conference Proceedings
Conference Proceedings
1. Passivation and Etching Behaviors of Copper Surface in Copper CMP Slurries
Eom, D.-H. ; Hong, Y.-K. ; Lee, S.-H. ; Park, J.-Y. ; Myung, J.-J. ; Park, J.-G. ; Kim, K.-S. ; Song, H.-S. ; Park, H.-S. ; Choi, Y.-S.
Pub. info.: Chemical Mechanical Planarization : proceedings of the International Symposium.  pp.226-236,  2002.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2002-1
2.

Conference Proceedings
Conference Proceedings
2. Nanotopography Effect of Improved Single-Side-Polished Wafer on Oxide CMP
Katoh, T. ; Park, J.-G. ; Park, J.-H. ; Paik, U.-G.
Pub. info.: Chemical Mechanical Planarization : proceedings of the International Symposium.  pp.193-201,  2002.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2002-1
3.

Conference Proceedings
Conference Proceedings
3. Spectral Analysis Method for Nanotopography Impact on Pad and Removal Depth Dependency in Oxide CMP
Park, J.-G. ; Katoh, T. ; Yoo, H-C. ; Paik, U.-G.
Pub. info.: Chemical Mechanical Planarization : proceedings of the International Symposium.  pp.202-209,  2002.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2002-1