1.

Conference Proceedings
Conference Proceedings
1. Chemical Mechanical Planarization of Ruthenium for Capacitor Bottom Electrode in DRAM Technology
Lee, S-H. ; Kang, Y-J ; Park, J-G. ; Lee, S-I.
Pub. info.: Thin film materials, processes, and reliability, plasma processing for the 100 nm node and copper interconnects with low-k inter-level dielectric films : proceedings of the international symposium.  pp.304-310,  2003.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2003-13
2.

Conference Proceedings
Conference Proceedings
2. Electrical Characterization of Slurry Particles and Their Interactions With Wafer Surfaces
Jeong, H-D. ; Kim, H-G. ; Lee, S-H. ; Moon, D-K. ; Park, J-G.
Pub. info.: Chemical mechanical polishing -- fundamentals and challenges : symposium held April 5-7, 1999, San Francisco, California, U.S.A..  pp.173-180,  2000.  Warrendale, PA.  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 566