1.

Conference Proceedings

Conference Proceedings
Lim, G. ; Kim, T.E. ; Lee, J.-H. ; Kim, I. ; Lee, H-W.
Pub. info.: Thin film materials, processes, and reliability, plasma processing for the 100 nm node and copper interconnects with low-k inter-level dielectric films : proceedings of the international symposium.  pp.266-271,  2003.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2003-13
2.

Conference Proceedings

Conference Proceedings
Lim, G. ; Lee, J.H. ; Kim, J.S. ; Lee, H.W. ; Hyun, S.H.
Pub. info.: Designing, processing and properties of advanced engineering materials : proceedings of the 3rd International Symposium on Designing, Processing and Properties of Advanced Engineering Materials, held in Jeju, Korea, November 5-8, 2003.  pp.1105-1108,  2004.  Zuerich.  Trans Tech Publications
Title of ser.: Materials science forum
Ser. no.: 449-452
3.

Conference Proceedings

Conference Proceedings
Lee, S.-J. ; Kong, H.-W. ; Kim, Y. ; Lee, G.-W. ; Lim, G. ; Cho, D.-W.
Pub. info.: Micro- and Nanotechnology: Materials, Processes, Packaging, and Systems II.  pp.200-208,  2004.  Bellingham, Wash..  SPIE - The International Society of Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 5650