Blank Cover Image

Thermo-Mechanical Reliability of Nano-Silver Sintered joints versus Lead-Free Solder Joints for Attaching Large-Area Silicon Devices.

Author(s):
Publication title:
2010 Power Systems Conference : SAE technical paper
Title of ser.:
Society of Automotive Engineers technical paper series
Ser. no.:
2010
Pub. Year:
2010
No.:
2010-01-1728
Paper no.:
2010-01-1728
Pages:
10
Pub. info.:
Warrendale, Penn.: Society of Automotive Engineers
ISSN:
01487191
Language:
English
Call no.:
S10400
Type:
Technical Paper

Similar Items:

N. Corbitt, C. Ngo, F. Lai

American Institute of Aeronautics and Astronautics

Jahsman, W. E., Lii, M. J., Renfro, T. A.

The American Society of Mechanical Engineers

Dauksher, W., Lau, J.

American Society of Mechanical Engineers

Hacke, P., Sprecher, A. F., Conrad, H.

The American Society of Mechanical Engineers

Steller, A., Zimmermann, A., Eisenberg, S., Wolter, K-J., Lange, P.

Society of Automotive Engineers

Baney, Brenda B., Bezier, Pascal, Campbell, Michael S., Parker, Richard D., Sneller, Pamela A., Walls, Delbert R., …

Society of Automotive Engineers

Islam, N., Suhling, J. C., Lall, P., Shete, T., Gale, H. S.

American Society of Mechanical Engineers

Tien, J. K., Hendrix, B. C., Attarwala, A. I.

The American Society of Mechanical Engineers

Moon, J.K., Kang, K.I., Jung, J.P., Lee, J.S., Zhou, Y.

Society of Manufacturing Engineers

Johnson, Zane

The American Society of Mechanical Engineers

Danielsson, H.

Society of Automotive Engineers

Lu, G-Q., Liu, X., Wen, S., Calata, J. N., Bai, J. G.

American Society of Mechanical Engineers

1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12