Thermo-Mechanical Reliability of Nano-Silver Sintered joints versus Lead-Free Solder Joints for Attaching Large-Area Silicon Devices.
- Author(s):
- Publication title:
- 2010 Power Systems Conference : SAE technical paper
- Title of ser.:
- Society of Automotive Engineers technical paper series
- Ser. no.:
- 2010
- Pub. Year:
- 2010
- No.:
- 2010-01-1728
- Paper no.:
- 2010-01-1728
- Pages:
- 10
- Pub. info.:
- Warrendale, Penn.: Society of Automotive Engineers
- ISSN:
- 01487191
- Language:
- English
- Call no.:
- S10400
- Type:
- Technical Paper
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