1.

Conference Proceedings
Conference Proceedings
1. CHARACTERIZATION OF THIN-FILM BESOI USING A CVD Si1x-y-Gex-By ETCH STOP
Desmond, C.A. ; Hunt, C.E. ; Wetteroth, T.
Pub. info.: Proceedings of the Seventh International Symposium on Silicon Materials Science and Technology.  pp.432-442,  1994.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 1994-10
2.

Conference Proceedings
Conference Proceedings
2. Backside Imaging CCD using Bonded and Etched Back Silicon on Epoxy
Booth, D.E. ; Hunt, C.E. ; Brown, W.E. ; Stover, R.J.
Pub. info.: Proceedings of the Fourth International Symposium on Semiconductor Wafer Bonding : science, technology, and applications.  pp.584-591,  1997.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 97-36
3.

Conference Proceedings
Conference Proceedings
3. P+ removal techniques for thin-film BESOI
Desmond, C.A. ; Hunt, C.E. ; Collins, S.D.
Pub. info.: Proceedings of the Sixth International Symposium on Silicon-on-Insulator Technology and Devices.  pp.111-116,  1994.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 1994-11
4.

Conference Proceedings
Conference Proceedings
4. Low Temperature Adhesion Bonding Methods
Booth, D. ; Hunt, C.E.
Pub. info.: Proceedings of the Third International Symposium on Semiconductor Wafer Bonding : physics and applications.  pp.201-211,  1995.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 95-7