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13 results

Conference Proceedings

1. *Microstructural characterization of antimonide based III-V compounds and their effect on electro-optical properties of substrate materials and devices

Dutta, P. S. ; Gutmann, R. J. ; Charache, G. W. ; Wang, C. A.

Pub. info.:	Optical microstructural characterization of semiconductors : sympoisum held November 29-30, 1999, Boston, Massachusetts, U.S.A.. pp.187-, 2000. Warrendale, Pa.. MRS-Materials Research Society
Title of ser.:	Materials Research Society symposium proceedings
Ser. no.:	588

Conference Proceedings

2. Recombination Parameters in InGaAsSb Epitaxial Layers for Thermophotovoltaic Applications

Kumar, R. J. ; Gutmann, R. J. ; Borrego, J. M. ; Dutta, P. S. ; Wang, C. A. ; Martinelli, R. U. ; Nichols, G.

Pub. info.:	Compound semiconductor photovoltaics : symposium held April 22-25, 2003, San Francisco, California, U.S.A.. pp.73-78, 2003. Warrendale, Pa.. Materials Research Society
Title of ser.:	Materials Research Society symposium proceedings
Ser. no.:	763

Conference Proceedings

3. Die-on-Wafer and Wafer-Level Three-Dimensional (3D) Integration of Heterogeneous IC Technologies for RF-Microwave-Millimeter Applications

Lu, J. Q. ; Devarajan, S. ; Zeng, A. Y. ; Rose, K. ; Gutmann, R. J.

Pub. info.:	Materials, integration and packaging issues for high-frequency devices. pp.229-234, 2004. Warrendale, Pa.. Materials Research Society
Title of ser.:	Materials Research Society symposium proceedings
Ser. no.:	833

Conference Proceedings

4. 200mm Silicon Wafer-to-Wafer Bonding with Thin Ti Layer under BEOL-Compatible Process Conditions

Yu, J. ; McMahon, J. J. ; Lu, J. Q. ; Gutmann, R. J.

Pub. info.:	Surface engineering 2004 - fundamentals and applications : symposium held November 30-December 2, 2004, Boston, Massachusetts, U.S.A.. pp.305-310, 2005. Warrendale, Pa.. Materials Research Society
Title of ser.:	Materials Research Society symposium proceedings
Ser. no.:	843

Conference Proceedings

5. Nitrogen vs. Phosphorus as Implant Species for High-Voltage Lateral RESURF MOSFETs on 4H-SiC

Chatty, K. ; Banerjee, S. ; Chow, T. P. ; Gutmann, R. J.

Pub. info.:	Silicon carbide and related materials - 1999 : ICSCRM'99, proceedings of the International Conference on Silicon Carbide and Related Materials - 1999, Research Triangle Park, North Carolina, USA, October 10-15, 1999. pp.1279-1282, 2000. Zuerich, Switzerland. Trans Tech Publications
Title of ser.:	Materials science forum
Ser. no.:	338-342(2)

Conference Proceedings

6. Dielectric Adhesive Wafer Bonding for Back-End Wafer-Level 3D Hyper-Integration

Lu, J. -Q. ; Caleand, T. S. ; Gutmann, R. J.

Pub. info.:	Dielectrics for nanosystems: materials science, processing, reliability, and manufacturing : proceedings of the First international symposium. pp.312-323, 2004. Pennington, N.J.. Electrochemical Society
Title of ser.:	Electrochemical Society Proceedings Series
Ser. no.:	2004-04

Conference Proceedings

7. Electrical Characteristics and Reliability of 4H-SiC PiN Diodes Fabricated on In-House Grown and Commercial Epitaxial Films

Losee, P. A. ; Li, C. ; Seiler, J. ; Stahlbush, R. E. ; Chow, T. P. ; Bhat, I. B. ; Gutmann, R. J.

Pub. info.:	Silicon carbide and related materials 2004 : ECSCRM 2004 : proceedings of the 5th European Conference on Silicon Carbide and Related Materials, August 31 - September 4 2004, Bologna, Italy. pp.961-964, 2005. Uetikon-Zuerich. Trans Tech Publications
Title of ser.:	Materials science forum
Ser. no.:	483-485

Conference Proceedings

8. Wafer Thinning for Monolithic 3D Integration

Jindal, A. ; Lu, J. -Q. ; Kwon, Y. ; Rajagopalan, G. ; McMahon, J. J. ; Zeng, A. Y. ; Flesher, H. K. ; Cale, T. S. ; Gutmann, R. J.

Pub. info.:	Materials, Technology and Reliability for Advanced Interconnects and Low-k Dielectrics-2003 : symposium held April 21-25, 2003, San Francisco, California, U.S.A.. pp.21-26, 2003. Warrendale, Pa.. Materials Research Society
Title of ser.:	Materials Research Society symposium proceedings
Ser. no.:	766

Conference Proceedings

9. Dielectric Glue Wafer Bonding for 3D ICs

Kwon, Y. ; Jindal, A. ; McMahon, J. J. ; Lu, J. -Q. ; Gutmann, R. J. ; Cale, T. S.

Pub. info.:	Materials, Technology and Reliability for Advanced Interconnects and Low-k Dielectrics-2003 : symposium held April 21-25, 2003, San Francisco, California, U.S.A.. pp.27-32, 2003. Warrendale, Pa.. Materials Research Society
Title of ser.:	Materials Research Society symposium proceedings
Ser. no.:	766

10.

Conference Proceedings

10. Slurries for Copper Damascene Patterning: Similarities and Differences

Jindal, A. ; Rajagopalan, G. ; Gupta, M. ; Lu, J. -Q. ; Rose, K. ; Gutmann, R. J.

Pub. info.:	Chemical-mechanical planarization : symposium held April 22-24, 2003, San Francisco, California, U.S.A.. pp.285-290, 2003. Warrendale, Pa.. Materials Research Society
Title of ser.:	Materials Research Society symposium proceedings
Ser. no.:	767

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