1.

Conference Proceedings
Conference Proceedings
1. Germanium on double-SOI photodetectors for 1550-nm operation
Dosunmu, O.I. ; Cannon, D.D. ; Emsley, M.K. ; Ghyselen, B. ; Liu, J. ; Kimerling, L.C. ; UEnlue, M. S.
Pub. info.: Semiconductor photodetectors : 28-29 January 2004, San Jose, California, USA.  pp.65-71,  2004.  Bellingham, Wash., USA.  SPIE - The International Society of Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 5353
2.

Conference Proceedings
Conference Proceedings
2. Strained Silicon on Insulator Wafers Made by the Smart CutTM Technology
Ghyselen, B. ; Bogumilowicz, Y. ; Aulnette, C. ; Abbadie, A. ; Osternaud, B. ; Besson, P. ; Daval, N. ; Andrieu, F. ; Cayrefourq, I. ; Moriceau, H. ; Ernst, T. ; Tiberj, A. ; Rayssac, O. ; Blondeau, B. ; Mazure, C. ; Lagahe-Blanchard, C. ; Pocas, S. ; Cartier, A.-M. ; Hartmann, J.-M. ; Leduc, P. ; Nardo, C.Di ; Lugand, J.-F. ; Fournel, F. ; Semeria, M.-N. ; Kernevez, N. ; Campidelli, Y. ; Kermarrec, O. ; Morand, Y. ; Rivoire, M. ; Bensahel, D. ; Paillard, V. ; Vincent, L. ; Claverie, A. ; Boucaud, P.
Pub. info.: High-mobility group-IV materials and devices : symposium held April 13-15, 2004, San Francisco, California, U.S.A..  pp.83-88,  2004.  Warrendale, Pa..  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 809
3.

Conference Proceedings
Conference Proceedings
3. The Bonding Energy Control: An Original Way to Debondable Substrates
Moriceau, H. ; Rayssac, O. ; Aspar, B. ; Ghyselen, B.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.49-56,  2003.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2003-19
4.

Conference Proceedings
Conference Proceedings
4. Germanium-on-Insulator (GeOI) Structure Realized by the Smart CutTM Technology
Letertre, F. ; Deguet, C. ; Richtarch, C. ; Faure, B. ; Hartmann, J.M. ; Chieu, F. ; Beaumont, A. ; Dechamp, J. ; Morales, C. ; Allibert, F. ; Perreau, P. ; Pocas, S. ; Personnic, S. ; Lagahe-Blanchard, C. ; Ghyselen, B. ; Vaillant, Y.M.Le ; Jalaguier, E. ; Kernevez, N. ; Mazure, C.
Pub. info.: High-mobility group-IV materials and devices : symposium held April 13-15, 2004, San Francisco, California, U.S.A..  pp.153-160,  2004.  Warrendale, Pa..  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 809
5.

Conference Proceedings
Conference Proceedings
5. Advanced SOI Structures Based on Wafer Bonding: A Short Review
Ghyselen, B.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.96-109,  2003.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2003-19
6.

Conference Proceedings
Conference Proceedings
6. Overview on Some Recent Advances in Wafer Bonding Technologies
Moriceau, H. ; Fournel, F. ; Rayssac, O. ; Cartier, A.M. ; Morales, C. ; Pocas, S. ; Zussy, M. ; Jalaguier, E. ; Biasse, B. ; Bataillou, B. ; Papon, A.M. ; Lagahe, C. ; Aspar, B. ; Maleville, C. ; Leterte, F. ; Ghyselen, B. ; Barge, T.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.1-16,  2001.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2001-27
7.

Conference Proceedings
Conference Proceedings
7. Smart Cut Technology: the path for advanced SOI substrates
Moriceau, H. ; Lagahe-Blanchard, C. ; Fournel, F. ; Pocas, S. ; Jalaguier, E. ; Perreau, P. ; Deguet, C. ; Ernst, T. ; Beaumont, A. ; Kernevez, N. ; Hartman, J.M. ; Ghyselen, B. ; Aulnette, C. ; Letertre, F. ; Rayssac, O. ; Faure, B. ; Richtarch, C. ; Cayrefourq, I.
Pub. info.: Science and technology of semiconductor-on-insulator structures and devices operating in a harsh environment.  pp.39-52,  2005.  Dordrecht.  Kluwer Academic Publishers
Title of ser.: NATO science series. Series 2, Mathematics, physics and chemistry
Ser. no.: 185
8.

Conference Proceedings
Conference Proceedings
8. QuaSiC Smart-Cut Substrates for SiC High Power Devices
Letertre, F. ; Jalaguier, E. ; Di Cioccio, L. ; Templier, F. ; Bluet, J.M. ; Banc, C. ; Matko, I. ; Chenevier, B. ; Bano, E. ; Guillot, G. ; Billon, T. ; Aspar, B. ; Madar, R. ; Ghyselen, B.
Pub. info.: Silicon carbide and related materials 2001 : ICSCRM2001, proceedings of the International Conference on Silicon Carbide and Related Materials 2001, Tsukuba, Japan, October 28-November 2, 2001.  pp.151-154,  2002.  Zuerich, Switzerland.  Trans Tech Publications
Title of ser.: Materials science forum
Ser. no.: 389-393
9.

Conference Proceedings
Conference Proceedings
9. Improved SiCOI Structures Elaborated by Heteroepitaxy of 3C-SiC on SOI
Chassagne, T. ; Ferro, G. ; Wang, H. ; Stoemenos, Y. ; Peyre, H. ; Contreras, S. ; Camassel, J. ; Monteil, Y. ; Ghyselen, B.
Pub. info.: Silicon carbide and related materials 2001 : ICSCRM2001, proceedings of the International Conference on Silicon Carbide and Related Materials 2001, Tsukuba, Japan, October 28-November 2, 2001.  pp.343-346,  2002.  Zuerich, Switzerland.  Trans Tech Publications
Title of ser.: Materials science forum
Ser. no.: 389-393
10.

Conference Proceedings
Conference Proceedings
10. QuaSiC Smart-Cut Substrates for SiC High Power Devices
Letertre, F. ; Jalaguier, E. ; Cioccio, L. D. ; Templier, F. ; Bluet, J.M. ; Banc, C. ; Matko, I. ; Chenevier, B. ; Bano, E. ; Guillot, G. ; Billon, T. ; Aspar, B. ; Madar, R. ; Ghyselen, B.
Pub. info.: Silicon carbide and related materials 2001 : ICSCRM2001, proceedings of the International Conference on Silicon Carbide and Related Materials 2001, Tsukuba, Japan, October 28-November 2, 2001.  pp.151-154,  2002.  Zuerich, Switzerland.  Trans Tech Publications
Title of ser.: Materials science forum
Ser. no.: 389-393