1.

Conference Proceedings
Conference Proceedings
1. Material and Electrical Characterization of HfO2 Films for MIM Capacitors Application
Hu, Hang ; Zhu, Chunxiang ; Lu, Y. F. ; Wu, Y. H. ; Liew, T. ; Li, M. F. ; Cho, B. J. ; Choi, W. K. ; Yakovlev, N.
Pub. info.: Materials, Technology and Reliability for Advanced Interconnects and Low-k Dielectrics-2003 : symposium held April 21-25, 2003, San Francisco, California, U.S.A..  pp.363-372,  2003.  Warrendale, Pa..  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 766
2.

Conference Proceedings
Conference Proceedings
2. Experimental Characterization of the Reliability of Multi-Terminal Dual-Damascene Copper Interconnect Trees
Gan, C. L. ; Thompson, C. V. ; Pey, K. L. ; Choi, W. K. ; Chang, C. W. ; Guo, Q.
Pub. info.: Materials, Technology and Reliability for Advanced Interconnects and Low-k Dielectrics-2003 : symposium held April 21-25, 2003, San Francisco, California, U.S.A..  pp.121-126,  2003.  Warrendale, Pa..  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 766