1.

Conference Proceedings
Conference Proceedings
1. Introducing Advanced ULK Dielectric Mateials in Interconnects: Performance and Integration Challenges
Fusalba, F. ; Cornec, C.Le ; Maury, P. ; Remiat, B. ; Jousseaume, V. ; Haxaire, K. ; Mourier, T. ; Haumesser, P.H ; Maitrejean, S. ; Simon, J. ; Chabli, A. ; Passemard, G. ; Fusalba, F. ; Cornec, C.Le ; Maury, P. ; Remiat, B. ; Jousseaume, V.
Pub. info.: Thin film materials, processes, and reliability, plasma processing for the 100 nm node and copper interconnects with low-k inter-level dielectric films : proceedings of the international symposium.  pp.186-205,  2003.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2003-13
2.

Conference Proceedings
Conference Proceedings
2. ADVANCED PHOTO RESIST REMOVAL USING O3 AND MOIST UPW IN SEMICONDUCTOR PRODUCTION
Philit, G. ; von Aswege, L. ; Madore, M. ; Wolke, K. ; Clech, M.-C. ; Asselin-Degrange, E. ; Chabli, A. ; Louis, D.
Pub. info.: Cleaning technology in semiconductor device manufacturing VIII : proceedings of the international symposium.  pp.356-361,  2003.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2003-26