Applications of CMOS processing to realize functional on-chip optical interconnects for VLSI (Invited Paper)
- Author(s):
- Clapp, T.V. ( Univ. of Cambridge (United Kingdom) )
- Cahill, L.W. ( La Trobe Univ. (Australia) )
- Publication title:
- Photonics Packaging and Integration III
- Title of ser.:
- Proceedings of SPIE - the International Society for Optical Engineering
- Ser. no.:
- 4997
- Pub. Year:
- 2003
- Page(from):
- 123
- Page(to):
- 126
- Pages:
- 4
- Pub. info.:
- Bellingham, Wash.: SPIE-The International Society for Optical Engineering
- ISSN:
- 0277786X
- ISBN:
- 9780819447975 [0819447978]
- Language:
- English
- Call no.:
- P63600/4997
- Type:
- Conference Proceedings
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