1.

Conference Proceedings

Conference Proceedings
Ruddell, F. ; Bain, M. ; Suder, S. ; Hurley, R.E. ; Armstrong, B.M. ; Fusco, V.F. ; Gamble, H.S.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.25-30,  2003.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2003-19
2.

Conference Proceedings

Conference Proceedings
Suder, S.L. ; Hurley, R. ; Li, F.X. ; Bain, M. ; Baine, P. ; MeNeill, D.W. ; Armstrong, B.M. ; Gamble, H.S.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.19-19,  2001.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2001-27
3.

Conference Proceedings

Conference Proceedings
Bain, M.F. ; Baine, P. ; McNeill, D.W. ; Srinivasan, G. ; Jankovic, N. ; McCartney, J. ; Moore, R.A. ; Armstrong, B.M. ; Gamble, H.S.
Pub. info.: Science and technology of semiconductor-on-insulator structures and devices operating in a harsh environment.  pp.103-108,  2005.  Dordrecht.  Kluwer Academic Publishers
Title of ser.: NATO science series. Series 2, Mathematics, physics and chemistry
Ser. no.: 185
4.

Conference Proceedings

Conference Proceedings
Bain, M. ; Stefanos, S. ; Baine, P. ; Loh, S.H. ; Jin, M. ; Montgomery, J.H. ; Armstrong, B.M. ; Gamble, H.S. ; Hamel, J. ; McNeill, D. W. ; Kraft, M. ; Kemhadjian, H.A.
Pub. info.: Science and technology of semiconductor-on-insulator structures and devices operating in a harsh environment.  pp.273-278,  2005.  Dordrecht.  Kluwer Academic Publishers
Title of ser.: NATO science series. Series 2, Mathematics, physics and chemistry
Ser. no.: 185